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CIXI ZHONGYI ELECTRONIC EQUIPMENT FACTORY,
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Gold Index: 11279
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Recycled Solderless Breadboard Projects General Insulation Thickness
| Place of Origin: | Zhejiang, China (Mainland) |
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Product Detail
Model No.:
ZY-25
Recycled Solderless Breadboard Projects General Insulation Thickness
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Recycled Solderless Breadboard Projects General Insulation Thickness
Specifications:
- Number of holes: 25 holes
- Layers: Single
- Insulation Material: Plastic (ABS)
- Insulation Thickness: General
- Reinforcing material: composite base
- Seven colors
Features:
- Can be recycled, recycling
- Structure colors clear and easy to use
- Breadboard assembly units can be fixed
Purpose:
- Experiment, testing, robotics, and mini breadboard floor with better results.
More Information:
| Item Number | ZY- 25 |
| Model | Tie-point 25 |
| Color | White, blue, red, green, yellow |
Image:
Tie-point 25
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Company Info
CIXI ZHONGYI ELECTRONIC EQUIPMENT FACTORY, [China (Mainland)]
Business Type:Manufacturer
City: Hangzhou
Province/State: Zhejiang
Country/Region: China (Mainland)
